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Silicon Devices and Process Integration - Deep Submicron and Nano-Scale Technologies (Paperback, Softcover reprint of hardcover 1st ed. 2009) Loot Price: R3,125
Discovery Miles 31 250
Silicon Devices and Process Integration - Deep Submicron and Nano-Scale Technologies (Paperback, Softcover reprint of hardcover...

Silicon Devices and Process Integration - Deep Submicron and Nano-Scale Technologies (Paperback, Softcover reprint of hardcover 1st ed. 2009)

Badih El-Kareh

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Loot Price R3,125 Discovery Miles 31 250 | Repayment Terms: R293 pm x 12*

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Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author's industrial and academic lecture notes and reflects years of experience in the development of silicon devices.

Features include:

  • A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;
  • State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;
  • CMOS-only applications, such as subthreshold current and parasitic latch-up;
  • Advanced Enabling processes and process integration.

This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Release date: October 2010
First published: 2009
Authors: Badih El-Kareh
Dimensions: 235 x 155 x 31mm (L x W x T)
Format: Paperback
Pages: 598
Edition: Softcover reprint of hardcover 1st ed. 2009
ISBN-13: 978-1-4419-4224-1
Categories: Books > Professional & Technical > Mechanical engineering & materials > Materials science > General
Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN: 1-4419-4224-6
Barcode: 9781441942241

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