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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (Hardcover)
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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (Hardcover)
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Examines the advantages of Embedded and FO-WLP technologies,
potential application spaces, package structures available in the
industry, process flows, and material challenges Embedded and
fan-out wafer level packaging (FO-WLP) technologies have been
developed across the industry over the past 15 years and have been
in high volume manufacturing for nearly a decade. This book covers
the advances that have been made in this new packaging technology
and discusses the many benefits it provides to the electronic
packaging industry and supply chain. It provides a compact overview
of the major types of technologies offered in this field, on what
is available, how it is processed, what is driving its development,
and the pros and cons. Filled with contributions from some of the
field's leading experts, Advances in Embedded and Fan-Out Wafer
Level Packaging Technologies begins with a look at the history of
the technology. It then goes on to examine the biggest technology
and marketing trends. Other sections are dedicated to chip-first
FO-WLP, chip-last FO-WLP, embedded die packaging, materials
challenges, equipment challenges, and resulting technology fusions.
Discusses specific company standards and their development results
Content relates to practice as well as to contemporary and future
challenges in electronics system integration and packaging Advances
in Embedded and Fan-Out Wafer Level Packaging Technologies will
appeal to microelectronic packaging engineers, managers, and
decision makers working in OEMs, IDMs, IFMs, OSATs, silicon
foundries, materials suppliers, equipment suppliers, and CAD tool
suppliers. It is also an excellent book for professors and graduate
students working in microelectronic packaging research.
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