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Lead-free Soldering Process Development and Reliability (Hardcover)
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Lead-free Soldering Process Development and Reliability (Hardcover)
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Covering the major topics in lead-free soldering Lead-free
Soldering Process Development and Reliability provides a
comprehensive discussion of all modern topics in lead-free
soldering. Perfect for process, quality, failure analysis and
reliability engineers in production industries, this reference will
help practitioners address issues in research, development and
production. Among other topics, the book addresses: - Developments
in process engineering (SMT, Wave, Rework, Paste Technology) - Low
temperature, high temperature and high reliability alloys -
Intermetallic compounds - PCB surface finishes and laminates -
Underfills, encapsulants and conformal coatings - Reliability
assessments In a regulatory environment that includes the adoption
of mandatory lead-free requirements in a variety of countries, the
book's explanations of high-temperature, low-temperature, and
high-reliability lead-free alloys in terms of process and
reliability implications are invaluable to working engineers.
Lead-free Soldering takes a forward-looking approach, with an eye
towards developments likely to impact the industry in the coming
years. These will include the introduction of lead-free
requirements in high-reliability electronics products in the
medical, automotive, and defense industries. The book provides
practitioners in these and other segments of the industry with
guidelines and information to help comply with these requirements.
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