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Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design

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3D IC and RF SiPs - Advanced Stacking and Planar Solutions for 5G Mobility (Hardcover) Loot Price: R3,281
Discovery Miles 32 810
3D IC and RF SiPs - Advanced Stacking and Planar Solutions for 5G Mobility (Hardcover): L.H. Wang

3D IC and RF SiPs - Advanced Stacking and Planar Solutions for 5G Mobility (Hardcover)

L.H. Wang

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Loot Price R3,281 Discovery Miles 32 810 | Repayment Terms: R307 pm x 12*

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An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

General

Imprint: Wiley-Blackwell
Country of origin: United States
Release date: June 2018
Authors: L.H. Wang
Dimensions: 248 x 170 x 27mm (L x W x T)
Format: Hardcover
Pages: 464
ISBN-13: 978-1-119-28964-7
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General
LSN: 1-119-28964-5
Barcode: 9781119289647

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