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Handbook of 3D Integration - Vol. 4: Design, Test and Thermal Management (Hardcover)
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Handbook of 3D Integration - Vol. 4: Design, Test and Thermal Management (Hardcover)
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This fourth volume of the landmark handbook focuses on the design,
testing and thermal management of 3D-integrated devices, both from
a technological and a materials science perspective. Edited and
authored by key figures from top research institutions and
high-tech companies, the first part of the book provides an
overview of the latest developments in 3D chip design, including
the particular challenges and potential. The second part is
concerned with the test methods used to assess the quality and
reliability of the 3D-integrated devices, while the third and final
part deals with thermal management.
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