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Proceedings of the Munich Symposium on Lightweight Design 2022 - Tagungsband zum Münchner Leichtbauseminar 2022 (1st ed.... Proceedings of the Munich Symposium on Lightweight Design 2022 - Tagungsband zum Münchner Leichtbauseminar 2022 (1st ed. 2024)
Jasper Rieser, Felix Endress, Alexander Horoschenkoff, Philipp Höfer, Tobias Dickhut, …
R4,191 Discovery Miles 41 910 Ships in 10 - 15 working days

Every year, the Technical University of Munich, the Universität der Bundeswehr München, and the University of Applied Sciences in Munich invite researchers and practitioners to join the Munich Symposium on Lightweight Design. Experts from industry and academia discuss design tools, applications, and new developments. Topics include, e.g., composite structures, SHM, microstructures, material modelling, design for additive manufacturing, numerical optimization and in particular topology optimization in aerospace, automotive and other industries. The talks are summarized in short articles and presented in this volume.

Proceedings of the Munich Symposium on Lightweight Design 2021 - Tagungsband zum Munchner Leichtbauseminar 2021 (English,... Proceedings of the Munich Symposium on Lightweight Design 2021 - Tagungsband zum Munchner Leichtbauseminar 2021 (English, German, Paperback, 1st ed. 2023)
Jasper Rieser, Felix Endress, Alexander Horoschenkoff, Philipp Hoefer, Tobias Dickhut, …
R4,928 Discovery Miles 49 280 Ships in 10 - 15 working days

Every year, the Technical University of Munich, the Universitat der Bundeswehr Munchen, and the University of Applied Sciences in Munich invite researchers and practitioners to join the Munich Symposium on Lightweight Design. Experts from industry and academia discuss design tools, applications, and new developments. Topics include, e.g., composite structures, SHM, microstructures, material modelling, design for additive manufacturing, numerical optimization and in particular topology optimization in aerospace, automotive and other industries. The talks are summarized in short articles and presented in this volume.

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