Avoiding Inelastic Strains in Solder Joint Interconnections of IC
Devices addresses analytical (mathematical) modeling approaches
aimed at understanding the underlying physics and mechanics of the
behavior and performance of solder materials and solder joint
interconnections of IC devices. The emphasis is on design for
reliability, including probabilistic predictions of the solder
lifetime. Describes how to use the developed methods of analytical
predictive modeling to minimize thermal stresses and strains in
solder joint of IC devices Shows how to build the preprocessing
models in finite-element analyses (FEA) by comparing the FEA and
analytical data Covers how to design the most effective test
vehicles for testing solder joints Details how to design and
organize, in addition to or sometimes even instead of highly
accelerated life tests (HALT), highly focused and highly
cost-effective failure oriented accelerated testing (FOAT) to
understand the physic of failure of solder joint interconnections
Outlines how to convert the low cycle fatigue conditions into
elastic fatigue conditions and to assess the fatigue lifetime in
such cases Illustrates ways to replace time- and labor-consuming,
expensive, and possibly misleading temperature cycling tests with
simpler and physically meaningful accelerated tests This book is
aimed towards professionals in electronic and photonic packaging,
electronic and optical materials, materials engineering, and
mechanical design.
General
Imprint: |
Crc Press
|
Country of origin: |
United Kingdom |
Release date: |
2021 |
First published: |
2021 |
Authors: |
Ephraim Suhir
|
Dimensions: |
234 x 156 x 31mm (L x W x T) |
Format: |
Hardcover
|
Pages: |
382 |
ISBN-13: |
978-1-138-62473-3 |
Categories: |
Books
|
LSN: |
1-138-62473-X |
Barcode: |
9781138624733 |
Is the information for this product incomplete, wrong or inappropriate?
Let us know about it.
Does this product have an incorrect or missing image?
Send us a new image.
Is this product missing categories?
Add more categories.
Review This Product
No reviews yet - be the first to create one!