Mechanics of Microelectronics (Hardcover, 2006 ed.)

The technology trends of Microelectronics and Microsystems are mainly characterized by miniaturization down to the nano-scale, increasing levels of system and function integration, and the introduction of new materials, while the business trends are mainly characterized by cost reduction, shorter-time-to market and outsourcing. Combination of these trends leads to increasing design complexity, dramatically decreasing design margins and process windows, reducing product development and qualification times, increasing risks of failures, and increasing difficulties to meet quality, robustness and reliability requirements. Consequentially, thermo-mechanical related failures, accounting for more than 65% of the total reliability failures, become the bottleneck for both current and future product and technology developments.

From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research.

Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-arttheories, methodologies, the way of working and real case studies, covering the contents of:

• The trends in Microelectronics and Microsystems
• Reliability engineering and practices
• Thermal management
• Advanced mechanics
• Thermo-mechanics of integrated circuits and packages
• Characterization and modelling of moisture behaviour
• Characterization and modelling of solder joint reliability
• Virtual thermo-mechanical prototyping
• Challenges and future perspectives.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Series:	Solid Mechanics and Its Applications, 141
Release date:	June 2006
First published:	2006
Authors:	G.Q. Zhang • W.D. van Driel • X. J Fan
Dimensions:	235 x 155 x 31mm (L x W x T)
Format:	Hardcover
Pages:	566
Edition:	2006 ed.
ISBN-13:	978-1-4020-4934-7
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General Promotions
LSN:	1-4020-4934-X
Barcode:	9781402049347

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