Through Silicon Via (TSV) is a key technology for realizing
three-dimensional integrated circuits (3D ICs) for future
high-performance and low-power systems with small form factors.
This book covers both qualitative and quantitative approaches to
give insights of modeling TSV in a various viewpoints such as
signal integrity, power integrity and thermal integrity. Most of
the analysis in this book includes simulations, numerical modelings
and measurements for verification. The author and co-authors in
each chapter have studied deep into TSV for many years and
the accumulated technical know-hows and tips for related subjects
are comprehensively covered.
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