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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Applied optics > Laser technology

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Packaging of High Power Semiconductor Lasers (Hardcover, 2015 ed.) Loot Price: R5,331
Discovery Miles 53 310
Packaging of High Power Semiconductor Lasers (Hardcover, 2015 ed.): Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu

Packaging of High Power Semiconductor Lasers (Hardcover, 2015 ed.)

Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu

Series: Micro- and Opto-Electronic Materials, Structures, and Systems

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Loot Price R5,331 Discovery Miles 53 310 | Repayment Terms: R500 pm x 12*

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This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Series: Micro- and Opto-Electronic Materials, Structures, and Systems
Release date: July 2014
First published: 2015
Authors: Xingsheng Liu • Wei Zhao • Lingling Xiong • Hui Liu
Dimensions: 235 x 155 x 22mm (L x W x T)
Format: Hardcover
Pages: 402
Edition: 2015 ed.
ISBN-13: 978-1-4614-9262-7
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Applied optics > Laser technology
LSN: 1-4614-9262-9
Barcode: 9781461492627

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