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Proceedings of the Munich Symposium on Lightweight Design 2020 - Tagungsband zum Munchner Leichtbauseminar 2020 (English,... Proceedings of the Munich Symposium on Lightweight Design 2020 - Tagungsband zum Munchner Leichtbauseminar 2020 (English, German, Paperback, 1st ed. 2021)
Simon Pfingstl, Alexander Horoschenkoff, Philipp Hoefer, Markus Zimmermann
R4,693 Discovery Miles 46 930 Ships in 10 - 15 working days

Every year, the Technical University of Munich, the Bundeswehr University, and the University of Applied Sciences in Munich invite researchers and practitioners to join the Munich Symposium on Lightweight Design. Experts from industry and academia discuss design tools, applications, and new developments. Topics include, e.g., composite structures, SHM, microstructures, material modelling, design for additive manufacturing, numerical optimization and in particular topology optimization in aerospace, automotive and other industries. The talks are summarized in short articles and presented in this volume.

Proceedings of the Munich Symposium on Lightweight Design 2021 - Tagungsband zum Munchner Leichtbauseminar 2021 (English,... Proceedings of the Munich Symposium on Lightweight Design 2021 - Tagungsband zum Munchner Leichtbauseminar 2021 (English, German, Paperback, 1st ed. 2023)
Jasper Rieser, Felix Endress, Alexander Horoschenkoff, Philipp Hoefer, Tobias Dickhut, …
R5,177 Discovery Miles 51 770 Ships in 10 - 15 working days

Every year, the Technical University of Munich, the Universitat der Bundeswehr Munchen, and the University of Applied Sciences in Munich invite researchers and practitioners to join the Munich Symposium on Lightweight Design. Experts from industry and academia discuss design tools, applications, and new developments. Topics include, e.g., composite structures, SHM, microstructures, material modelling, design for additive manufacturing, numerical optimization and in particular topology optimization in aerospace, automotive and other industries. The talks are summarized in short articles and presented in this volume.

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