This book summarizes research advances in micromechanics modeling of ductile fractures made in the past two decades. The ultimate goal of this book is to reach manufacturing frontline designers and materials engineers by providing a user-oriented, theoretical background of micromechanics modeling. Accordingly, the book is organized in a unique way, first presenting a vigorous damage percolation model developed by the authors over the last ten years. This model overcomes almost all difficulties of the existing models and can be used to completely accommodate ductile damage developments within a single-measure microstructure frame. Related void damage criteria including nucleation, growth and coalescence are then discussed in detail: how they are improved, when and where they are used in the model, and how the model performs in comparison with the existing models. Sample forming simulations are provided to illustrate the model s performance.

This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.

This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.

This book summarizes research advances in micromechanics modeling of ductile fractures made in the past two decades. The ultimate goal of this book is to reach manufacturing frontline designers and materials engineers by providing a user-oriented, theoretical background of micromechanics modeling. Accordingly, the book is organized in a unique way, first presenting a vigorous damage percolation model developed by the authors over the last ten years. This model overcomes almost all difficulties of the existing models and can be used to completely accommodate ductile damage developments within a single-measure microstructure frame. Related void damage criteria including nucleation, growth and coalescence are then discussed in detail: how they are improved, when and where they are used in the model, and how the model performs in comparison with the existing models. Sample forming simulations are provided to illustrate the model's performance.