LCP for Microwave Packages and Modules (Hardcover, New)

A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.

General

Imprint:	Cambridge UniversityPress
Country of origin:	United Kingdom
Series:	The Cambridge RF and Microwave Engineering Series
Release date:	June 2012
First published:	June 2012
Authors:	Anh-Vu H. Pham • Morgan J. Chen (Staff RF Engineer) • Kunia Aihara
Dimensions:	253 x 176 x 16mm (L x W x T)
Format:	Hardcover
Pages:	266
Edition:	New
ISBN-13:	978-1-107-00378-1
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Promotions
LSN:	1-107-00378-4
Barcode:	9781107003781

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