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Electromigration In Ulsi Interconnections (Hardcover)
Loot Price: R2,863
Discovery Miles 28 630
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Electromigration In Ulsi Interconnections (Hardcover)
Series: International Series On Advances In Solid State Electronics And Technology, 0
Expected to ship within 10 - 15 working days
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Total price: R2,883
Discovery Miles: 28 830
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Electromigration in ULSI Interconnections provides a comprehensive
description of the electromigration in integrated circuits. It is
intended for both beginner and advanced readers on electromigration
in ULSI interconnections. It begins with the basic knowledge
required for a detailed study on electromigration, and examines the
various interconnected systems and their evolution employed in
integrated circuit technology. The subsequent chapters provide a
detailed description of the physics of electromigration in both Al-
and Cu-based Interconnections, in the form of theoretical,
experimental and numerical modeling studies. The differences in the
electromigration of Al- and Cu-based interconnections and the
corresponding underlying physical mechanisms for these differences
are explained. The test structures, testing methodology, failure
analysis methodology and statistical analysis of the test data for
the experimental studies on electromigration are presented in a
concise and rigorous manner. Methods of numerical modeling for the
interconnect electromigration and their applications to the
understanding of electromigration physics are described in detail
with the aspects of material properties, interconnection design,
and interconnect process parameters on the electromigration
performances of interconnects in ULSI further elaborated upon.
Finally, the extension of the studies to narrow interconnections is
introduced, and future challenges on the study of electromigration
are outlined and discussed.
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