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More-than-Moore Devices and Integration for Semiconductors (Hardcover, 1st ed. 2023) Loot Price: R2,440
Discovery Miles 24 400
Repayment Terms: R229 pm x 12*
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More-than-Moore Devices and Integration for Semiconductors (Hardcover, 1st ed. 2023): Francesca Iacopi, Francis Balestra

More-than-Moore Devices and Integration for Semiconductors (Hardcover, 1st ed. 2023)

Francesca Iacopi, Francis Balestra

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Loot Price R2,440 Discovery Miles 24 400 | Repayment Terms: R229 pm x 12*

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This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

General

Imprint: Springer International Publishing AG
Country of origin: Switzerland
Release date: February 2023
First published: 2023
Editors: Francesca Iacopi • Francis Balestra
Dimensions: 235 x 155mm (L x W)
Format: Hardcover
Pages: 200
Edition: 1st ed. 2023
ISBN-13: 978-3-03-121609-1
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
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LSN: 3-03-121609-1
Barcode: 9783031216091

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