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Materials & Process Integration for MEMS (Hardcover, 2002 ed.)
Loot Price: R4,436
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Materials & Process Integration for MEMS (Hardcover, 2002 ed.)
Series: Microsystems, 9
Expected to ship within 12 - 17 working days
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The field of materials and process integration for MEMS research
has an extensive past as well as a long and promising future.
Researchers, academicians and engineers from around the world are
increasingly devoting their efforts on the materials and process
integration issues and opportunities in MEMS devices. These efforts
are crucial to sustain the long-term growth of the MEMS field. The
commercial MEMS community is heavily driven by the push for
profitable and sustainable products. In the course of establishing
high volume and low-cost production processes, the critical
importance of materials properties, behaviors, reliability,
reproducibility, and predictability, as well as process integration
of compatible materials systems become apparent. Although standard
IC fabrication steps, particularly lithographic techniques, are
leveraged heavily in the creation of MEMS devices, additional
customized and novel micromachining techniques are needed to
develop sophisticated MEMS structures. One of the most common
techniques is bulk micromachining, by which micromechanical
structures are created by etching into the bulk of the substrates
with either anisotropic etching with strong alk: ali solution or
deep reactive-ion etching (DRIB). The second common technique is
surface micromachining, by which planar microstructures are created
by sequential deposition and etching of thin films on the surface
of the substrate, followed by a fmal removal of sacrificial layers
to release suspended structures. Other techniques include deep
lithography and plating to create metal structures with high aspect
ratios (LIGA), micro electrodischarge machining (J."
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