3D integration is an emerging technology for the design of
many-core microprocessors and memory integration. This book,
Advances in 3D Integrated Circuits and Systems, is written to help
readers understand 3D integrated circuits in three stages: device
basics, system level management, and real designs.Contents
presented in this book include fabrication techniques for 3D TSV
and 2.5D TSI; device modeling; physical designs; thermal, power and
I/O management; and 3D designs of sensors, I/Os, multi-core
processors, and memory.Advanced undergraduates, graduate students,
researchers and engineers may find this text useful for
understanding the many challenges faced in the development and
building of 3D integrated circuits and systems.
General
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