Books > Professional & Technical > Mechanical engineering & materials > Materials science
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Low-dielectric Constant Materials V (Hardcover)
Loot Price: R818
Discovery Miles 8 180
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Low-dielectric Constant Materials V (Hardcover)
Series: MRS Proceedings, Volume 565
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Interest in developing low-dielectric constant materials is driven
by requirements from the microelectronics sector to improve
performance in interconnections by reducing parasitic capacitance
and cross talk. The continuing increase in density of semiconductor
devices is becoming limited by the dielectric properties of the
insulator which threatens to slow the rate of productivity. The
requirement for dielectric constant is rapidly approaching an e
value of 2.0, with continued improvement sought even below this
level to maintain this progression, commonly known as Moore's Law.
Synthetic methods of obtaining materials in this range are
addressed in this book. The materials solution to the interconnect
problem - changing the insulator to lower the dielectric constant
from 4.0, the e of silicon dioxide - introduces a host of
reliability concerns, as well as changes to the process of
manufacturing semiconductor devices. Topics include: porous films -
organic and inorganic; porous films - organic/low-k integration;
low-k integration; low-k/advanced interconnect; low-dielectric
constant materials and applications in microelectronics and low-k
film property/integration.
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