Dry Etching Technology for Semiconductors (Paperback, Softcover reprint of the original 1st ed. 2015)

This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	September 2016
First published:	2015
Authors:	Kazuo Nojiri
Dimensions:	235 x 155 x 7mm (L x W x T)
Format:	Paperback
Pages:	116
Edition:	Softcover reprint of the original 1st ed. 2015
ISBN-13:	978-3-319-35624-2
Subtitles:	Japanese
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors Promotions
LSN:	3-319-35624-0
Barcode:	9783319356242

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