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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
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Semiconductor Research Trends (Hardcover, Illustrated Ed)
Loot Price: R4,517
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Semiconductor Research Trends (Hardcover, Illustrated Ed)
Expected to ship within 12 - 17 working days
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This book includes within its scope studies of the structural,
electrical, optical and acoustical properties of bulk,
low-dimensional and amorphous semiconductors; computational
semiconductor physics; interface properties, including the physics
and chemistry of heterojunctions, metal-semiconductor and
insulator-semiconductor junctions; all multi-layered structures
involving semiconductor components. Dopant incorporation. Growth
and preparation of materials, including both epitaxial (e.g.
molecular beam and chemical vapour methods) and bulk techniques; in
situ monitoring of epitaxial growth processes, also included are
appropriate aspects of surface science such as the influence of
growth kinetics and chemical processing on layer and device
properties. The physics of semiconductor electronic and
optoelectronic devices are examined , including theoretical
modelling and experimental demonstration; all aspects of the
technology of semiconductor device and circuit fabrication.
Relevant areas of 'molecular electronics' and semiconductor
structures incorporating Langmuir- Blodgett films; resists,
lithography and metallisation where they are concerned with the
definition of small geometry structure. The structural, electrical
and optical characterisation of materials and device structures are
also included. The scope encompasses materials and device
reliability: reliability evaluation of technologies; failure
analysis and advanced analysis techniques such as SEM, E-beam,
optical emission microscopy, acoustic microscopy techniques; liquid
crystal techniques; noise measurement, reliability prediction and
simulation; reliability indicators; failure mechanisms, including
charge migration, trapping, oxide breakdown, hot carrier effects,
electro-migration, stress migration; package- related failure
mechanisms; effects of operational and environmental stresses on
reliability.
General
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