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Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design

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Arbitrary Modeling of TSVs for 3D Integrated Circuits (Paperback, Softcover reprint of the original 1st ed. 2015) Loot Price: R3,373

Discovery Miles 33 730

Repayment Terms: R316 pm x 12*

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Arbitrary Modeling of TSVs for 3D Integrated Circuits (Paperback, Softcover reprint of the original 1st ed. 2015): Khaled...

Arbitrary Modeling of TSVs for 3D Integrated Circuits (Paperback, Softcover reprint of the original 1st ed. 2015)

Khaled Salah, Yehea Ismail, Alaa El-Rouby

Series: Analog Circuits and Signal Processing

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Loot Price R3,373 Discovery Miles 33 730 | Repayment Terms: R316 pm x 12*

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Series:	Analog Circuits and Signal Processing
Release date:	August 2016
First published:	2015
Authors:	Khaled Salah • Yehea Ismail • Alaa El-Rouby
Dimensions:	235 x 155 x 10mm (L x W x T)
Format:	Paperback
Pages:	179
Edition:	Softcover reprint of the original 1st ed. 2015
ISBN-13:	978-3-319-37497-0
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General Promotions
LSN:	3-319-37497-4
Barcode:	9783319374970