Arbitrary Modeling of TSVs for 3D Integrated Circuits (Hardcover, 2015 ed.)

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductorand inductive-based communication system and bandpass filtering."

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Series:	Analog Circuits and Signal Processing
Release date:	September 2014
First published:	2015
Authors:	Khaled Salah • Yehea Ismail • Alaa El-Rouby
Dimensions:	235 x 155 x 13mm (L x W x T)
Format:	Hardcover
Pages:	179
Edition:	2015 ed.
ISBN-13:	978-3-319-07610-2
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General
LSN:	3-319-07610-8
Barcode:	9783319076102

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