Solder Joint Technology - Materials, Properties, and Reliability (Hardcover, 2007 ed.)

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliablity problems are discussed.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Series:	Springer Series in Materials Science, 92
Release date:	August 2007
First published:	2007
Authors:	King-Ning Tu
Dimensions:	235 x 156 x 23mm (L x W x T)
Format:	Hardcover
Pages:	370
Edition:	2007 ed.
ISBN-13:	978-0-387-38890-8
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Metals technology / metallurgy
LSN:	0-387-38890-7
Barcode:	9780387388908

Is the information for this product incomplete, wrong or inappropriate? Let us know about it.

Does this product have an incorrect or missing image? Send us a new image.

Is this product missing categories? Add more categories.

Review This Product

No reviews yet - be the first to create one!