Recent Progress in Lead-Free Solder Technology - Materials Development, Processing and Performances (1st ed. 2022)

This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying.  The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

General

Imprint:	Springer Nature Switzerland AG
Country of origin:	Switzerland
Series:	Topics in Mining, Metallurgy and Materials Engineering
Release date:	March 2023
First published:	2022
Editors:	Mohd Arif Anuar Mohd Salleh • Mohd Sharizal Abdul Aziz • Azman Jalar • Mohd Izrul Izwan Ramli
Dimensions:	235 x 155mm (L x W)
Pages:	328
Edition:	1st ed. 2022
ISBN-13:	978-3-03-093443-9
Categories:	Books Promotions
LSN:	3-03-093443-8
Barcode:	9783030934439

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