RF Measurements of Die and Packages (Hardcover)

The explosion in the wireless industry, coupled with the higher frequencies in today's digital integrated circuits (IC) has made vital the need for accurate IC testing. This is the first book dedicated to the issues surrounding RFIC testing. This ground breaking work enables professionals to perform high-accuracy RF measurements of die and packages in the RF test lab. This timely volume defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration.

General

Imprint:	Artech House Publishers
Country of origin:	United States
Series:	Microwave Library
Release date:	May 2002
First published:	May 2002
Authors:	Scott Wartenberg
Dimensions:	234 x 156 x 14mm (L x W x T)
Format:	Hardcover - Laminated cover
Pages:	244
ISBN-13:	978-1-58053-273-0
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN:	1-58053-273-X
Barcode:	9781580532730

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