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Long-Term Reliability of Nanometer VLSI Systems - Modeling, Analysis and Optimization (Hardcover, 1st ed. 2019) Loot Price: R4,655
Discovery Miles 46 550
Long-Term Reliability of Nanometer VLSI Systems - Modeling, Analysis and Optimization (Hardcover, 1st ed. 2019): Sheldon Tan,...

Long-Term Reliability of Nanometer VLSI Systems - Modeling, Analysis and Optimization (Hardcover, 1st ed. 2019)

Sheldon Tan, Mehdi Tahoori, Taeyoung Kim, Shengcheng Wang, Zeyu Sun, Saman Kiamehr

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Loot Price R4,655 Discovery Miles 46 550 | Repayment Terms: R436 pm x 12*

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This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques. Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models; Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects; Presents a cross-layer approach to transistor aging modeling, analysis and mitigation, spanning multiple abstraction levels; Equips readers for EM-induced dynamic reliability management and energy or lifetime optimization techniques, for many-core dark silicon microprocessors, embedded systems, lower power many-core processors and datacenters.

General

Imprint: Springer Nature Switzerland AG
Country of origin: Switzerland
Release date: September 2019
First published: 2019
Authors: Sheldon Tan • Mehdi Tahoori • Taeyoung Kim • Shengcheng Wang • Zeyu Sun • Saman Kiamehr
Dimensions: 235 x 155mm (L x W)
Format: Hardcover
Pages: 460
Edition: 1st ed. 2019
ISBN-13: 978-3-03-026171-9
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General
LSN: 3-03-026171-9
Barcode: 9783030261719

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