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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Automatic control engineering > Robotics

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Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System - An Edition of the Selected Papers from the 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2017) (Hardcover, 1st ed. 2018) Loot Price: R6,430

Discovery Miles 64 300

Repayment Terms: R603 pm x 12*

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Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System - An Edition of the...

Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System - An Edition of the Selected Papers from the 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2017) (Hardcover, 1st ed. 2018)

Sukhan Lee, Hanseok Ko, Songhwai Oh

Series: Lecture Notes in Electrical Engineering, 501

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Loot Price R6,430 Discovery Miles 64 300 | Repayment Terms: R603 pm x 12*

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This book includes selected papers from the 13th IEEE International Conference on Multisensor Integration and Fusion for Intelligent Systems (MFI 2017) held in Daegu, Korea, November 16-22, 2017. It covers various topics, including sensor/actuator networks, distributed and cloud architectures, bio-inspired systems and evolutionary approaches, methods of cognitive sensor fusion, Bayesian approaches, fuzzy systems and neural networks, biomedical applications, autonomous land, sea and air vehicles, localization, tracking, SLAM, 3D perception, manipulation with multifinger hands, robotics, micro/nano systems, information fusion and sensors, and multimodal integration in HCI and HRI. The book is intended for robotics scientists, data and information fusion scientists, researchers and professionals at universities, research institutes and laboratories.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Series:	Lecture Notes in Electrical Engineering, 501
Release date:	July 2018
First published:	2018
Editors:	Sukhan Lee • Hanseok Ko • Songhwai Oh
Dimensions:	235 x 155mm (L x W)
Format:	Hardcover
Pages:	300
Edition:	1st ed. 2018
ISBN-13:	978-3-319-90508-2
Categories:	Books > Professional & Technical > Electronics & communications engineering > Communications engineering / telecommunications > General Books > Computing & IT > Applications of computing > Artificial intelligence > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Automatic control engineering > Robotics Promotions
LSN:	3-319-90508-2
Barcode:	9783319905082