This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying.  The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

This book gathers the latest research, innovations, and applications in the field of corrosion prevention and control, as presented by leading national and international academics, researchers, engineers, and postgraduate students at the AWAM International Conference on Civil Engineering 2022 (AICCE'22), held 7th International Corrosion Prevention Symposium for Research Scholars (CORSYM 2021), held as a virtual conference on November 2021. The CORSYM 2021 theme, Nurturing Future Corrosionist for Better Corrosion Mitigation, covered key topics such as corrosion and inhibitors, corrosion of biomaterials, top of line corrosion, H2S and CO2 corrosion, coatings and composites for biomedical devices, electrochemical testing techniques, advanced materials and coatings, corrosion in concrete structures, welding and hot Corrosion, corrosion in ships and marine structures, corrosion of biomaterials, corrosion Under insulation, digitalization in corrosion. The contributions introduce numerous exciting ideas that spur novel research directions and foster multidisciplinary collaborations between various specialists in the field of corrosion engineering.