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[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and
the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the
growing popularity of such systems. Furthermore, Intel's very
recently announced 80-core TeraFLOP chip [5] exemplifies the
irreversible march toward many-core systems with tens or even
hundreds of processing elements. 1.2 The Dawn of the
Communication-Centric Revolution The multi-core thrust has ushered
the gradual displacement of the computati- centric design model by
a more communication-centric approach [6]. The large, sophisticated
monolithic modules are giving way to several smaller, simpler p-
cessing elements working in tandem. This trend has led to a surge
in the popularity of multi-core systems, which typically manifest
themselves in two distinct incarnations: heterogeneous
Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip
Multi-Processors (CMP). The SoC philosophy revolves around the
technique of Platform-Based Design (PBD) [7], which advocates the
reuse of Intellectual Property (IP) cores in flexible design
templates that can be customized accordingly to satisfy the demands
of particular implementations. The appeal of such a modular
approach lies in the substantially reduced Time-To- Market (TTM)
incubation period, which is a direct outcome of lower circuit
complexity and reduced design effort. The whole system can now be
viewed as a diverse collection of pre-existing IP components
integrated on a single die.
[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and
the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the
growing popularity of such systems. Furthermore, Intel's very
recently announced 80-core TeraFLOP chip [5] exemplifies the
irreversible march toward many-core systems with tens or even
hundreds of processing elements. 1.2 The Dawn of the
Communication-Centric Revolution The multi-core thrust has ushered
the gradual displacement of the computati- centric design model by
a more communication-centric approach [6]. The large, sophisticated
monolithic modules are giving way to several smaller, simpler p-
cessing elements working in tandem. This trend has led to a surge
in the popularity of multi-core systems, which typically manifest
themselves in two distinct incarnations: heterogeneous
Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip
Multi-Processors (CMP). The SoC philosophy revolves around the
technique of Platform-Based Design (PBD) [7], which advocates the
reuse of Intellectual Property (IP) cores in flexible design
templates that can be customized accordingly to satisfy the demands
of particular implementations. The appeal of such a modular
approach lies in the substantially reduced Time-To- Market (TTM)
incubation period, which is a direct outcome of lower circuit
complexity and reduced design effort. The whole system can now be
viewed as a diverse collection of pre-existing IP components
integrated on a single die.
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