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Network-on-Chip Architectures - A Holistic Design Exploration (Hardcover, 2010 ed.) Loot Price: R1,435
Discovery Miles 14 350
You Save: R2,763 (66%)
Network-on-Chip Architectures - A Holistic Design Exploration (Hardcover, 2010 ed.): Chrysostomos Nicopoulos, Vijaykrishnan...

Network-on-Chip Architectures - A Holistic Design Exploration (Hardcover, 2010 ed.)

Chrysostomos Nicopoulos, Vijaykrishnan Narayanan, Chita R Das

Series: Lecture Notes in Electrical Engineering, 45

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List price R4,198 Loot Price R1,435 Discovery Miles 14 350 | Repayment Terms: R134 pm x 12* You Save R2,763 (66%)

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[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel's very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die.

General

Imprint: Springer
Country of origin: Netherlands
Series: Lecture Notes in Electrical Engineering, 45
Release date: October 2009
First published: 2009
Authors: Chrysostomos Nicopoulos • Vijaykrishnan Narayanan • Chita R Das
Dimensions: 235 x 155 x 22mm (L x W x T)
Format: Hardcover
Pages: 223
Edition: 2010 ed.
ISBN-13: 978-90-481-3030-6
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General
LSN: 90-481-3030-1
Barcode: 9789048130306

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