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Functional Metamaterials and Metadevices (Hardcover, 1st ed. 2018): Xingcun Colin Tong Functional Metamaterials and Metadevices (Hardcover, 1st ed. 2018)
Xingcun Colin Tong
R5,325 Discovery Miles 53 250 Ships in 12 - 19 working days

To meet the demands of students, scientists and engineers for a systematic reference source, this book introduces, comprehensively and in a single voice, research and development progress in emerging metamaterials and derived functional metadevices. Coverage includes electromagnetic, optical, acoustic, thermal, and mechanical metamaterials and related metadevices. Metamaterials are artificially engineered composites with designed properties beyond those attainable in nature and with applications in all aspects of materials science. From spatially tailored dielectrics to tunable, dynamic materials properties and unique nonlinear behavior, metamaterial systems have demonstrated tremendous flexibility and functionality in electromagnetic, optical, acoustic, thermal, and mechanical engineering. Furthermore, the field of metamaterials has been extended from the mere pursuit of various exotic properties towards the realization of practical devices, leading to the concepts of dynamically-reconfigurable metadevices and functional metasurfaces. The book explores the fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications to electronics, telecommunications, antennas, and energy harvesting. Future challenges and potential in regard to design, modeling and fabrication are also addressed.

Advanced Materials for Integrated Optical Waveguides (Hardcover, 2014 ed.): Xingcun Colin Tong Ph. D. Advanced Materials for Integrated Optical Waveguides (Hardcover, 2014 ed.)
Xingcun Colin Tong Ph. D.
R4,460 Discovery Miles 44 600 Ships in 10 - 15 working days

This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find "Advanced Materials for Integrated Optical Waveguides" to be an invaluable reference for meeting these research and development goals.

Advanced Materials for Thermal Management of Electronic Packaging (Hardcover, 2011 Ed.): Xingcun Colin Tong Advanced Materials for Thermal Management of Electronic Packaging (Hardcover, 2011 Ed.)
Xingcun Colin Tong
R7,029 Discovery Miles 70 290 Ships in 12 - 19 working days

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Advanced Materials and Components for 5G and Beyond (Hardcover, 1st ed. 2022): Colin Tong Advanced Materials and Components for 5G and Beyond (Hardcover, 1st ed. 2022)
Colin Tong
R4,587 Discovery Miles 45 870 Ships in 12 - 19 working days

This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for today's students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.

Advanced Materials and Design for Electromagnetic Interference Shielding (Hardcover): Xingcun Colin Tong Advanced Materials and Design for Electromagnetic Interference Shielding (Hardcover)
Xingcun Colin Tong
R5,396 Discovery Miles 53 960 Ships in 12 - 19 working days

With electromagnetic compliance (EMC) now a major factor in the design of all electronic products, it is crucial to understand how electromagnetic interference (EMI) shielding products are used in various industries. Focusing on the practicalities of this area, Advanced Materials and Design for Electromagnetic Interference Shielding comprehensively introduces the design guidelines, materials selection, characterization methodology, manufacturing technology, and future potential of EMI shielding.

After an overview of EMI shielding theory and product design guidelines, the book extensively reviews the characterization methodology of EMI materials. Subsequent chapters focus on particular EMI shielding materials and component designs, including enclosures, metal-formed gaskets, conductive elastomer and flexible graphite components, conductive foam and ventilation structures, board-level shielding materials, composite materials and hybrid structures, absorber materials, grounding and cable-level shielding materials, and aerospace and nuclear shielding materials. The last chapter presents a perspective on future trends in EMI shielding materials and design.

Offering detailed coverage on many important topics, this indispensable book illustrates the efficiency and reliability of a range of materials and design solutions for EMI shielding.

Advanced Materials for Printed Flexible Electronics (Hardcover, 1st ed. 2022): Colin Tong Advanced Materials for Printed Flexible Electronics (Hardcover, 1st ed. 2022)
Colin Tong
R4,972 Discovery Miles 49 720 Ships in 12 - 19 working days

This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.

Introduction to Materials for Advanced Energy Systems (Hardcover, 1st ed. 2019): Colin Tong Introduction to Materials for Advanced Energy Systems (Hardcover, 1st ed. 2019)
Colin Tong
R3,830 Discovery Miles 38 300 Ships in 10 - 15 working days

This first of its kind text enables today's students to understand current and future energy challenges, to acquire skills for selecting and using materials and manufacturing processes in the design of energy systems, and to develop a cross-functional approach to materials, mechanics, electronics and processes of energy production. While taking economic and regulatory aspects into account, this textbook provides a comprehensive introduction to the range of materials used for advanced energy systems, including fossil, nuclear, solar, bio, wind, geothermal, ocean and hydropower, hydrogen, and nuclear, as well as thermal energy storage and electrochemical storage in fuel cells. A separate chapter is devoted to emerging energy harvesting systems. Integrated coverage includes the application of scientific and engineering principles to materials that enable different types of energy systems. Properties, performance, modeling, fabrication, characterization and application of structural, functional and hybrid materials are described for each energy system. Readers will appreciate the complex relationships among materials selection, optimizing design, and component operating conditions in each energy system. Research and development trends of novel emerging materials for future hybrid energy systems are also considered. Each chapter is basically a self-contained unit, easily enabling instructors to adapt the book for coursework. This textbook is suitable for students in science and engineering who seek to obtain a comprehensive understanding of different energy processes, and how materials enable energy harvesting, conversion, and storage. In setting forth the latest advances and new frontiers of research, the text also serves as a comprehensive reference on energy materials for experienced materials scientists, engineers, and physicists. Includes pedagogical features such as in-depth side bars, worked-out and end-of- chapter exercises, and many references to further reading Provides comprehensive coverage of materials-based solutions for major and emerging energy systems Brings together diverse subject matter by integrating theory with engaging insights

Advanced Materials for Thermal Management of Electronic Packaging (Paperback, 2011 ed.): Xingcun Colin Tong Advanced Materials for Thermal Management of Electronic Packaging (Paperback, 2011 ed.)
Xingcun Colin Tong
R7,153 Discovery Miles 71 530 Ships in 10 - 15 working days

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Advanced Materials for Printed Flexible Electronics (Paperback, 1st ed. 2022): Colin Tong Advanced Materials for Printed Flexible Electronics (Paperback, 1st ed. 2022)
Colin Tong
R5,190 Discovery Miles 51 900 Ships in 10 - 15 working days

This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.

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