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Functional Metamaterials and Metadevices (Hardcover, 1st ed. 2018) Loot Price: R5,200
Discovery Miles 52 000
Functional Metamaterials and Metadevices (Hardcover, 1st ed. 2018): Xingcun Colin Tong

Functional Metamaterials and Metadevices (Hardcover, 1st ed. 2018)

Xingcun Colin Tong

Series: Springer Series in Materials Science, 262

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Loot Price R5,200 Discovery Miles 52 000 | Repayment Terms: R487 pm x 12*

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To meet the demands of students, scientists and engineers for a systematic reference source, this book introduces, comprehensively and in a single voice, research and development progress in emerging metamaterials and derived functional metadevices. Coverage includes electromagnetic, optical, acoustic, thermal, and mechanical metamaterials and related metadevices. Metamaterials are artificially engineered composites with designed properties beyond those attainable in nature and with applications in all aspects of materials science. From spatially tailored dielectrics to tunable, dynamic materials properties and unique nonlinear behavior, metamaterial systems have demonstrated tremendous flexibility and functionality in electromagnetic, optical, acoustic, thermal, and mechanical engineering. Furthermore, the field of metamaterials has been extended from the mere pursuit of various exotic properties towards the realization of practical devices, leading to the concepts of dynamically-reconfigurable metadevices and functional metasurfaces. The book explores the fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications to electronics, telecommunications, antennas, and energy harvesting. Future challenges and potential in regard to design, modeling and fabrication are also addressed.

General

Imprint: Springer International Publishing AG
Country of origin: Switzerland
Series: Springer Series in Materials Science, 262
Release date: September 2017
First published: 2018
Authors: Xingcun Colin Tong
Dimensions: 235 x 155mm (L x W)
Format: Hardcover
Pages: 277
Edition: 1st ed. 2018
ISBN-13: 978-3-319-66043-1
Categories: Books > Professional & Technical > Mechanical engineering & materials > Materials science > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 3-319-66043-8
Barcode: 9783319660431

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