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Solder Joint Technology - Materials, Properties, and Reliability (Hardcover, 2007 ed.): King-Ning Tu Solder Joint Technology - Materials, Properties, and Reliability (Hardcover, 2007 ed.)
King-Ning Tu
R6,538 Discovery Miles 65 380 Ships in 10 - 15 working days

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliablity problems are discussed.

Solder Joint Technology - Materials, Properties, and Reliability (Paperback, Softcover reprint of hardcover 1st ed. 2007):... Solder Joint Technology - Materials, Properties, and Reliability (Paperback, Softcover reprint of hardcover 1st ed. 2007)
King-Ning Tu
R6,342 Discovery Miles 63 420 Ships in 10 - 15 working days

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Electronic Thin-Film Reliability (Hardcover): King-Ning Tu Electronic Thin-Film Reliability (Hardcover)
King-Ning Tu
R1,880 Discovery Miles 18 800 Ships in 12 - 19 working days

Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

Understanding the Reliability Technology Based on Entropy Production, and Other Researches (Paperback): King-Ning Tu Understanding the Reliability Technology Based on Entropy Production, and Other Researches (Paperback)
King-Ning Tu
R4,038 Discovery Miles 40 380 Ships in 10 - 15 working days
Silicon and Silicide Nanowires - Applications, Fabrication, and Properties (Hardcover): Yu Huang, King-Ning Tu Silicon and Silicide Nanowires - Applications, Fabrication, and Properties (Hardcover)
Yu Huang, King-Ning Tu
R3,595 Discovery Miles 35 950 Ships in 12 - 19 working days

Nanoscale materials are showing great promise in various electronic, optoelectronic, and energy applications. Silicon (Si) has especially captured great attention as the leading material for microelectronic and nanoscale device applications. Recently, various silicides have garnered special attention for their pivotal role in Si device engineering and for the vast potential they possess in fields such as thermoelectricity and magnetism. The fundamental understanding of Si and silicide material processes at nanoscale plays a key role in achieving device structures and performance that meet real-world requirements and, therefore, demands investigation and exploration of nanoscale device applications. This book comprises the theoretical and experimental analysis of various properties of silicon nanocrystals, research methods and techniques to prepare them, and some of their promising applications.

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