Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed.
The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise.
Key Features
* Discusses reliability and failure on both the chip and packaging levels
* Handles the role of defects in yield and reliability
* Includes a tutorial chapter on the mathematics of reliability
* Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints
* Considers defect detection methods and failure analysis techniques

This well-established and well-regarded reference work offers unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects and radiation damage. This new edition will add cutting edge knowledge gained in both research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.
-Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints
-New updated sections on "failure physics," on mass transport-induced failure in Cu and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections.
-New chapter on testing procedures, sample handling and sample selection, and experimental design.
-Coverage of new packaging materials, including plastics and composites

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field.
Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

Solutions Manual to Accompany Engineering Materials Science provides information pertinent to the fundamental aspects of materials science. This book presents a compilation of solutions to a variety of problems or issues in engineering materials science. Organized into 15 chapters, this book begins with an overview of the approximate added value in a contact lens manufactured from a polymer. This text then examines several problems based on the electron energy levels for various elements. Other chapters explain why the lattice constants of materials can be determined with extraordinary precision by X-ray diffraction, but with constantly less precision and accuracy using electron diffraction techniques. This book discusses as well the formula for the condensation reaction between urea and formaldehyde to produce thermosetting urea-formaldehyde. The final chapter deals with the similarities between electrically and mechanically functional materials with regard to reliability issues. This book is a valuable resource for engineers, students, and research workers.