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Reliability and Failure of Electronic Materials and Devices (Hardcover, 2nd edition)
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Reliability and Failure of Electronic Materials and Devices (Hardcover, 2nd edition)
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This well-established and well-regarded reference work offers
unique, single-source coverage of most major topics related to the
performance and failure of materials used in electronic devices and
electronics packaging. With a focus on statistically predicting
failure and product yields, this book can help the design engineer,
manufacturing engineer and quality control engineer all better
understand the common mechanisms that lead to electronics materials
failures, including dielectric breakdown, hot-electron effects and
radiation damage. This new edition will add cutting edge knowledge
gained in both research labs and on the manufacturing floor, with
new sections on plastics and other new packaging materials, new
testing procedures, and new coverage of MEMS devices.
-Covers all major types of electronics materials degradation and
their causes, including dielectric breakdown, hot-electron effects,
electrostatic discharge, corrosion, and failure of contacts and
solder joints
-New updated sections on "failure physics," on mass
transport-induced failure in Cu and low-k dielectrics, and on
reliability of lead-free/reduced-lead solder connections.
-New chapter on testing procedures, sample handling and sample
selection, and experimental design.
-Coverage of new packaging materials, including plastics and
composites
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