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Thermal Management of Electronic Systems, v. 1 - Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands... Thermal Management of Electronic Systems, v. 1 - Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands (Hardcover)
C.J. Hoogendoorn, Etc; Edited by J.M. Burgers, R.A.W.M. Henkes, C.J.M. Lasance
R2,609 Discovery Miles 26 090 Ships in 12 - 19 working days

This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. This text is suitable for research and development engineers and scientists whose work involves the design and manufacture of electronic systems.

Thermal Management of Electronic Systems - Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands... Thermal Management of Electronic Systems - Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands (Paperback, Softcover reprint of the original 1st ed. 1994)
C.J. Hoogendoorn, R.A.W.M. Henkes, C.J.M. Lasance
R1,543 Discovery Miles 15 430 Ships in 10 - 15 working days

The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she* had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.

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