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Thermal Management of Electronic Systems - Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands (Paperback, Softcover reprint of the original 1st ed. 1994)
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Thermal Management of Electronic Systems - Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands (Paperback, Softcover reprint of the original 1st ed. 1994)
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The Eurotherm Committee has chosen Thermal Management of Electronic
Systems as the subject of its 29th Seminar, at Delft University of
Technology, the Netherlands, 14-16 June 1993. This volume
constitutes the proceedings of the Seminar. Thermal Management is
but one of the several critical topics in the design of electronic
systems. However, as a result of the combined effects of increasing
heat fluxes, miniaturisation and the striving for zero defects,
preferably in less time and at a lower cost than before, thermal
management has become an increasingly tough challenge. Therefore,
it is being increasingly recognised that cooling requirements could
eventually hamper the technical progress in miniaturisation. It
might be argued that we are on the verge of a revolution in thermal
management techniques. Previously, a packaging engineer had no way
of predicting the tempera tures of critical electronic parts with
the required accuracy. He or she* had to rely on full-scale
experiments, doubtful design rules, or worst-case estimates. This
situation is going to be changed in the foreseeable future.
User-friendly software tools, the acquisition and integrity of
input and output data, the badly needed training mea sures, the
introduction into a concurrent engineering environment: all these
items will exert a heavy toll on the flexibility of the electronics
industries. Fortunately, this situation is being realised at the
appropriate management levels, and the interest in this seminar and
the pre-conference tutorials testifies to this assertion.
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