|
Showing 1 - 3 of
3 matches in All Departments
This work takes advantage of high-resolution silicon stencil masks
to build air-stable complementary OTFTs using a low-temperature
fabrication process. Plastic electronics based on organic thin-film
transistors (OTFTs) pave the way for cheap, flexible and large-area
products. Over the past few years, OTFTs have undergone remarkable
advances in terms of reliability, performance and scale of
integration. Many factors contribute to the allure of this
technology; the masks exhibit excellent stiffness and stability,
thus allowing OTFTs with submicrometer channel lengths and superb
device uniformity to be patterned. Furthermore, the OTFTs employ an
ultra-thin gate dielectric that provides a sufficiently high
capacitance to enable the transistors to operate at voltages as low
as 3 V. The critical challenges in this development are the subtle
mechanisms that govern the properties of aggressively scaled OTFTs.
These mechanisms, dictated by device physics, are well described
and implemented into circuit-design tools to ensure adequate
simulation accuracy.
This work takes advantage of high-resolution silicon stencil masks
to build air-stable complementary OTFTs using a low-temperature
fabrication process. Plastic electronics based on organic thin-film
transistors (OTFTs) pave the way for cheap, flexible and large-area
products. Over the past few years, OTFTs have undergone remarkable
advances in terms of reliability, performance and scale of
integration. Many factors contribute to the allure of this
technology; the masks exhibit excellent stiffness and stability,
thus allowing OTFTs with submicrometer channel lengths and superb
device uniformity to be patterned. Furthermore, the OTFTs employ an
ultra-thin gate dielectric that provides a sufficiently high
capacitance to enable the transistors to operate at voltages as low
as 3 V. The critical challenges in this development are the subtle
mechanisms that govern the properties of aggressively scaled OTFTs.
These mechanisms, dictated by device physics, are well described
and implemented into circuit-design tools to ensure adequate
simulation accuracy.
Free vascularized fibular graft can be transferred to reconstruct
skeletal defects of the extremities. It may be combined with skin,
fascia, muscle, and growth-plate tissue to address the needs of the
recipient site. It may be cut transversely and folded to
reconstruct the length and width of tibial or femoral defects. The
main indications for this graft are defects larger than 5 to 6 cm
or with poor vascularity of the surrounding soft tissues. Detailed
preoperative planning, experience in microvascular techniques, and
careful postoperative follow-up are necessary to minimize
complications and improve outcome.
|
|