This book describes the principles of integrated assessment models (IAM) for climate change economics and introduces various computable models for different development mechanisms under climate change governance. The authors present several new models they have constructed based on the RICE framework, specifically the MRICES((multi-factor RICE)) and EMRICES models, which incorporate global economic interactions into the RICE framework, and the CINCIA model, which describes technological advances and industrial structure evolution, introducing the mechanism of evolutionary economics. The models discussed in the book help governments and policy-makers tackle climate change and take positive measures on climate governance as well as promote economic and social development to narrow the gaps between countries.

This book introduces the latest progress in six degrees of freedom (6-DoF) haptic rendering with the focus on a new approach for simulating force/torque feedback in performing tasks that require dexterous manipulation skills. One of the major challenges in 6-DoF haptic rendering is to resolve the conflict between high speed and high fidelity requirements, especially in simulating a tool interacting with both rigid and deformable objects in a narrow space and with fine features. The book presents a configuration-based optimization approach to tackle this challenge. Addressing a key issue in many VR-based simulation systems, the book will be of particular interest to researchers and professionals in the areas of surgical simulation, rehabilitation, virtual assembly, and inspection and maintenance.

"An essential source for the study of events in early China, a guide to the moral philosophy of the gentlemen of Han, and a splendid work of literature which may be read for the pleasure of its style and the power of its narrative. . . . This work makes Shi ji and its scholarship accessible to any reader of English, and it is a model for any work in this field and style." -Bulletin of the School of Oriental and African Studies "Through such work as this, the scholarly and literary community of the West will learn more of the splendor and romance of early China, and may better appreciate the lessons in humanity presented by its great historian." -Bulletin of the School of Oriental and African Studies "Nienhauser's new translation is scrupulously scholarly . . . the design of this series is nearly flawless . . . the translation itself is very precise." -Chinese Literature: Essays, Articles, Reviews This project will result in the first complete translation (in nine volumes) of the Shih chi (The Grand Scribe's Records), one of the most important narratives in traditional China. Ssu-ma Ch'ien (145-ca. 86 BC), who compiled the work, is known as the Herodotus of China.

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process-including design and manufacturing technologies-is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today 's information industry. The packaging process including design and manufacturing technologies is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.

Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge.

Elucidates the evolving world of packaging technologies for manufacturing

The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection.

With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

This book describes the principles of integrated assessment models (IAM) for climate change economics and introduces various computable models for different development mechanisms under climate change governance. The authors present several new models they have constructed based on the RICE framework, specifically the MRICES((multi-factor RICE)) and EMRICES models, which incorporate global economic interactions into the RICE framework, and the CINCIA model, which describes technological advances and industrial structure evolution, introducing the mechanism of evolutionary economics. The models discussed in the book help governments and policy-makers tackle climate change and take positive measures on climate governance as well as promote economic and social development to narrow the gaps between countries.