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Practical Guide to the Packaging of Electronics - Thermal and Mechanical Design and Analysis, Third Edition (Paperback, 3rd edition)
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Practical Guide to the Packaging of Electronics - Thermal and Mechanical Design and Analysis, Third Edition (Paperback, 3rd edition)
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Successfully Estimate the Thermal and Mechanical Characteristics of
Electronics Systems A definitive guide for practitioners new to the
field or requiring a refresher course, Practical Guide to the
Packaging of Electronics: Thermal and Mechanical Design and
Analysis, Third Edition provides an understanding of system
failures and helps identify the areas where they can occur.
Specifically designed for the mechanical, electrical, or quality
engineer, the book addresses engineering issues involved in
electronics packaging and provides the basics needed to design a
new system or troubleshoot a current one. Updated to reflect recent
developments in the field, this latest edition adds two new
chapters on acoustic and reliability fundamentals, and contains
more information on electrical failures and causes. It also
includes tools for understanding heat transfer, shock, and
vibration. Additionally, the author: Addresses various
cross-discipline issues in the design of electromechanical products
Provides a solid foundation for heat transfer, vibration, and life
expectancy calculations Identifies reliability issues and concerns
Develops the ability to conduct a more thorough analysis for the
final design Includes design tips and guidelines for each aspect of
electronics packaging Practical Guide to the Packaging of
Electronics: Thermal and Mechanical Design and Analysis, Third
Edition explains the mechanical and thermal/fluid aspects of
electronic product design and offers a basic understanding of
electronics packaging design issues. Defining the material
in-depth, it also describes system design guidelines and identifies
reliability concerns for practitioners in mechanical, - electrical
or quality engineering.
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