This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3,
please visit Set 2: Thermal Packaging Tools and Set 3: Thermal
Packaging Applications /remove Thermal and mechanical packaging -
the enabling technologies for the physical implementation of
electronic systems - are responsible for much of the progress in
miniaturization, reliability, and functional density achieved by
electronic, microelectronic, and nanoelectronic products during the
past 50 years. The inherent inefficiency of electronic devices and
their sensitivity to heat have placed thermal packaging on the
critical path of nearly every product development effort in
traditional, as well as emerging, electronic product
categories.Successful thermal packaging is the key differentiator
in electronic products, as diverse as supercomputers and cell
phones, and continues to be of pivotal importance in the refinement
of traditional products and in the development of products for new
applications. The Encyclopedia of Thermal Packaging, compiled in
multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2:
Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and
Set 4: Thermal Packaging Configurations) will provide a
comprehensive, one-stop treatment of the techniques, tools,
applications, and configurations of electronic thermal packaging.
Each of the author-written sets presents the accumulated wisdom and
shared perspectives of a few luminaries in the thermal management
of electronics.Set 1: Thermal Packaging TechniquesThe first set of
the Encyclopedia, Thermal Packaging Techniques, focuses on the
technology "building blocks" used to assemble a complete thermal
management system and provide detailed descriptions of the
underlying phenomena, modeling equations, and correlations, as well
as guidance for achieving the optimal designs of individual
"building blocks" and their insertion in the overall thermal
solution. Specific volumes deal with microchannel coolers, cold
plates, immersion cooling modules, thermoelectric microcoolers, and
cooling devices for solid state lighting systems, as well as
techniques and procedures for the experimental characterization of
thermal management components. These "building blocks" are the
essential elements in the creation of a complete, cost-effective
thermal management system.The four sets in the Encyclopedia of
Thermal Packaging will provide the novice and student with a
complete reference for a quick ascent on the thermal packaging
';learning curve,'; the practitioner with a validated set of
techniques and tools to face every challenge, and researchers with
a clear definition of the state-of-the-art and emerging needs to
guide their future efforts. This encyclopedia will, thus, be of
great interest to packaging engineers, electronic product
development engineers, and product managers, as well as to
researchers in thermal management of electronic and photonic
components and systems, and most beneficial to undergraduate and
graduate students studying mechanical, electrical, and electronic
engineering.
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