The technology trends of Microelectronics and Microsystems are
mainly characterized by miniaturization down to the nano-scale,
increasing levels of system and function integration, and the
introduction of new materials, while the business trends are mainly
characterized by cost reduction, shorter-time-to market and
outsourcing. Combination of these trends leads to increasing design
complexity, dramatically decreasing design margins and process
windows, reducing product development and qualification times,
increasing risks of failures, and increasing difficulties to meet
quality, robustness and reliability requirements. Consequentially,
thermo-mechanical related failures, accounting for more than 65% of
the total reliability failures, become the bottleneck for both
current and future product and technology developments.
From a mechanical engineering point of view, Microelectronics
and Microsystems are multi-scale in both geometric and time
domains, multi-process, multi-functionality, multi-disciplinary,
multi-material/interface, multi-damage and multi-failure mode.
Their responses in manufacturing, assembling, qualification tests
and application conditions are strongly nonlinear and stochastic.
Mechanics of Microelectronics is extremely important and
challenging, in terms of both industrial applications and academic
research.
Written by the leading experts with both profound knowledge and
rich practical experience in advanced mechanics and
microelectronics industry, this book aims to provide the cutting
edge knowledge and solutions for various mechanical related
problems, in a systematic way. It contains essential and detailed
information about the state-of-the-art theories, methodologies, the
way of working and real case studies, covering the contents of:
- The trends in Microelectronics and Microsystems
- Reliability engineering and practices
- Thermal management
- Advanced mechanics
- Thermo-mechanics of integrated circuits and packages
- Characterization and modelling of moisture behaviour
- Characterization and modelling of solder joint reliability
- Virtual thermo-mechanical prototyping
- Challenges and future perspectives.
General
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