Three-Dimensional Integration of Semiconductors - Processing, Materials, and Applications (Hardcover, 1st ed. 2015)

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	December 2015
First published:	2015
Editors:	Kazuo Kondo • Morihiro Kada • Kenji Takahashi
Dimensions:	235 x 155 x 24mm (L x W x T)
Format:	Hardcover - Cloth over boards
Pages:	408
Edition:	1st ed. 2015
ISBN-13:	978-3-319-18674-0
Categories:	Books > Professional & Technical > Mechanical engineering & materials > Mechanical engineering > General Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN:	3-319-18674-4
Barcode:	9783319186740

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