Low Dielectric Constant Materials for IC Applications (Hardcover, 2003 ed.)

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

General

Imprint:	Springer-Verlag
Country of origin:	Germany
Series:	Springer Series in Advanced Microelectronics, 9
Release date:	November 2002
First published:	2003
Editors:	Paul S. Ho • Jihperng Leu • Wei William Lee
Dimensions:	235 x 155 x 19mm (L x W x T)
Format:	Hardcover
Pages:	310
Edition:	2003 ed.
ISBN-13:	978-3-540-67819-9
Categories:	Books > Science & Mathematics > Physics > Electricity, magnetism & electromagnetism Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General Promotions
LSN:	3-540-67819-0
Barcode:	9783540678199

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