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3D Integration of Resistive Switching Memory (Hardcover)
Loot Price: R1,555
Discovery Miles 15 550
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3D Integration of Resistive Switching Memory (Hardcover)
Series: Frontiers in Semiconductor Technology
Expected to ship within 9 - 15 working days
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This book offers a thorough exploration of the three-dimensional
integration of resistive memory in all aspects, from the materials,
devices, array-level issues, and integration structures to its
applications. Resistive random-access memory (RRAM) is one of the
most promising candidates for next-generation nonvolatile memory
applications owing to its superior characteristics including simple
structure, high switching speed, low power consumption, and
compatibility with standard complementary metal oxide semiconductor
(CMOS) process. To achieve large-scale, high-density integration of
RRAM, the 3D cross array is undoubtedly the ideal choice. This book
introduces the 3D integration technology of RRAM, and breaks it
down into five parts: 1: Associative Problems in Crossbar array and
3D architectures; 2: Selector Devices and Self-Selective Cells; 3:
Integration of 3D RRAM; 4: Reliability Issues in 3D RRAM; 5:
Applications of 3D RRAM beyond Storage. The book aspires to provide
a relevant reference for students, researchers, engineers, and
professionals working with resistive random-access memory or those
interested in 3D integration technology in general.
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