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System-level Modeling of MEMS (Hardcover, Volume 10) Loot Price: R3,818
Discovery Miles 38 180
You Save: R733 (16%)
System-level Modeling of MEMS (Hardcover, Volume 10): Tamara Bechtold, Gabriele Schrag, Lihong Feng

System-level Modeling of MEMS (Hardcover, Volume 10)

Tamara Bechtold, Gabriele Schrag, Lihong Feng; Edited by Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata

Series: Advanced Micro and Nanosystems

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List price R4,551 Loot Price R3,818 Discovery Miles 38 180 | Repayment Terms: R358 pm x 12* You Save R733 (16%)

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System-level modeling of MEMS - microelectromechanical systems - comprises integrated approaches to simulate, understand, and optimize the performance of sensors, actuators, and microsystems, taking into account the intricacies of the interplay between mechanical and electrical properties, circuitry, packaging, and design considerations. Thereby, system-level modeling overcomes the limitations inherent to methods that focus only on one of these aspects and do not incorporate their mutual dependencies. The book addresses the two most important approaches of system-level modeling, namely physics-based modeling with lumped elements and mathematical modeling employing model order reduction methods, with an emphasis on combining single device models to entire systems. At a clearly understandable and sufficiently detailed level the readers are made familiar with the physical and mathematical underpinnings of MEMS modeling. This enables them to choose the adequate methods for the respective application needs. This work is an invaluable resource for all materials scientists, electrical engineers, scientists working in the semiconductor and/or sensor industry, physicists, and physical chemists.

General

Imprint: Wiley-VCH Verlag GmbH
Country of origin: Germany
Series: Advanced Micro and Nanosystems
Release date: February 2013
First published: March 2013
Authors: Tamara Bechtold • Gabriele Schrag • Lihong Feng
Editors: Oliver Brand • Gary K. Fedder • Christofer Hierold • Jan G. Korvink • Osamu Tabata
Dimensions: 244 x 175 x 32mm (L x W x T)
Format: Hardcover
Pages: 562
Edition: Volume 10
ISBN-13: 978-3-527-31903-9
Categories: Books > Professional & Technical > Mechanical engineering & materials > General
Books > Professional & Technical > Electronics & communications engineering > General
LSN: 3-527-31903-4
Barcode: 9783527319039

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