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Multichip Modules with Integrated Sensors (Paperback, Softcover reprint of the original 1st ed. 1996) Loot Price: R2,976
Discovery Miles 29 760
Multichip Modules with Integrated Sensors (Paperback, Softcover reprint of the original 1st ed. 1996): W.K. Jones, Gabor...

Multichip Modules with Integrated Sensors (Paperback, Softcover reprint of the original 1st ed. 1996)

W.K. Jones, Gabor Harsanyi

Series: NATO Science Partnership Subseries: 3, 16

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Loot Price R2,976 Discovery Miles 29 760 | Repayment Terms: R279 pm x 12*

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Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by the Technical University of Budapest, Budapest, Hungary, on May 18-20, 1995. Additionally, the Hungarian Chapter of ISHM-The Microelectronics Society held a poster session on this topic. This volume presents the majority of papers presented at the ARW and the ISHM-Hungary Session. The integration of sensors with high .performance MCM structures represent the trend for intelligent electronics. The book reviews advances in MCM technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have lead to the enhanced performance of smart electronics. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging.

General

Imprint: Springer
Country of origin: Netherlands
Series: NATO Science Partnership Subseries: 3, 16
Release date: October 2011
First published: 1996
Editors: W.K. Jones • Gabor Harsanyi
Dimensions: 240 x 160 x 18mm (L x W x T)
Format: Paperback
Pages: 336
Edition: Softcover reprint of the original 1st ed. 1996
ISBN-13: 978-9401066310
Categories: Books > Professional & Technical > Mechanical engineering & materials > Mechanical engineering > General
Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Mechanical engineering & materials > Materials science > Testing of materials > General
LSN: 9401066310
Barcode: 9789401066310

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