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Materials & Process Integration for MEMS (Hardcover, 2002 ed.): Francis E.H. Tay Materials & Process Integration for MEMS (Hardcover, 2002 ed.)
Francis E.H. Tay
R4,534 Discovery Miles 45 340 Ships in 10 - 15 working days

The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk: ali solution or deep reactive-ion etching (DRIB). The second common technique is surface micromachining, by which planar microstructures are created by sequential deposition and etching of thin films on the surface of the substrate, followed by a fmal removal of sacrificial layers to release suspended structures. Other techniques include deep lithography and plating to create metal structures with high aspect ratios (LIGA), micro electrodischarge machining (J."

Microfluidics and BioMEMS Applications (Hardcover, 2002 ed.): Francis E.H. Tay Microfluidics and BioMEMS Applications (Hardcover, 2002 ed.)
Francis E.H. Tay
R4,558 Discovery Miles 45 580 Ships in 10 - 15 working days

Microfluidics and BioMEMS Applications central idea is on microfluidics, a relatively new research field which finds its niche in biomedical devices, especially on lab-on-a-chip and related products. Being the essential component in providing driving fluidic flows, an example of micropump is chosen to illustrate a complete cycle in development of microfluidic devices which include literature review, designing and modelling, fabrication and testing. A few articles are included to demonstrate the idea of tackling this research problem, and they cover the main development scope discussed earlier as well as other advanced modelling schemes for microfluidics and beyond.

Scientists and students working in the areas of MEMS and microfluidics will benefit from this book, which may serve both communities as both a reference monograph and a textbook for courses in numerical simulation, and design and development of microfluidic devices.

Microfluidics and BioMEMS Applications (Paperback, Softcover reprint of hardcover 1st ed. 2002): Francis E.H. Tay Microfluidics and BioMEMS Applications (Paperback, Softcover reprint of hardcover 1st ed. 2002)
Francis E.H. Tay
R4,372 Discovery Miles 43 720 Ships in 10 - 15 working days

Microfluidics and BioMEMS Applications central idea is on microfluidics, a relatively new research field which finds its niche in biomedical devices, especially on lab-on-a-chip and related products. Being the essential component in providing driving fluidic flows, an example of micropump is chosen to illustrate a complete cycle in development of microfluidic devices which include literature review, designing and modelling, fabrication and testing. A few articles are included to demonstrate the idea of tackling this research problem, and they cover the main development scope discussed earlier as well as other advanced modelling schemes for microfluidics and beyond.

Scientists and students working in the areas of MEMS and microfluidics will benefit from this book, which may serve both communities as both a reference monograph and a textbook for courses in numerical simulation, and design and development of microfluidic devices.

Materials & Process Integration for MEMS (Paperback, Softcover reprint of hardcover 1st ed. 2002): Francis E.H. Tay Materials & Process Integration for MEMS (Paperback, Softcover reprint of hardcover 1st ed. 2002)
Francis E.H. Tay
R4,358 Discovery Miles 43 580 Ships in 10 - 15 working days

The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk: ali solution or deep reactive-ion etching (DRIB). The second common technique is surface micromachining, by which planar microstructures are created by sequential deposition and etching of thin films on the surface of the substrate, followed by a fmal removal of sacrificial layers to release suspended structures. Other techniques include deep lithography and plating to create metal structures with high aspect ratios (LIGA), micro electrodischarge machining (J."

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