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Books > Science & Mathematics > Physics > Classical mechanics

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Materials & Process Integration for MEMS (Paperback, Softcover reprint of hardcover 1st ed. 2002) Loot Price: R4,348
Discovery Miles 43 480
Materials & Process Integration for MEMS (Paperback, Softcover reprint of hardcover 1st ed. 2002): Francis E.H. Tay

Materials & Process Integration for MEMS (Paperback, Softcover reprint of hardcover 1st ed. 2002)

Francis E.H. Tay

Series: Microsystems, 9

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Loot Price R4,348 Discovery Miles 43 480 | Repayment Terms: R407 pm x 12*

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The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk: ali solution or deep reactive-ion etching (DRIB). The second common technique is surface micromachining, by which planar microstructures are created by sequential deposition and etching of thin films on the surface of the substrate, followed by a fmal removal of sacrificial layers to release suspended structures. Other techniques include deep lithography and plating to create metal structures with high aspect ratios (LIGA), micro electrodischarge machining (J."

General

Imprint: Springer-Verlag New York
Country of origin: United States
Series: Microsystems, 9
Release date: December 2010
First published: 2002
Editors: Francis E.H. Tay
Dimensions: 235 x 155 x 17mm (L x W x T)
Format: Paperback
Pages: 299
Edition: Softcover reprint of hardcover 1st ed. 2002
ISBN-13: 978-1-4419-5303-2
Categories: Books > Science & Mathematics > Physics > Classical mechanics > General
Books > Professional & Technical > Mechanical engineering & materials > Materials science > Testing of materials > General
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LSN: 1-4419-5303-5
Barcode: 9781441953032

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