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This monograph presents recent advances in neural network (NN)
approaches and applications to chemical reaction dynamics. Topics
covered include: (i) the development of ab initio potential-energy
surfaces (PES) for complex multichannel systems using modified
novelty sampling and feedforward NNs; (ii) methods for sampling the
configuration space of critical importance, such as trajectory and
novelty sampling methods and gradient fitting methods; (iii)
parametrization of interatomic potential functions using a genetic
algorithm accelerated with a NN; (iv) parametrization of analytic
interatomic potential functions using NNs; (v) self-starting
methods for obtaining analytic PES from ab inito electronic
structure calculations using direct dynamics; (vi) development of a
novel method, namely, combined function derivative approximation
(CFDA) for simultaneous fitting of a PES and its corresponding
force fields using feedforward neural networks; (vii) development
of generalized PES using many-body expansions, NNs, and moiety
energy approximations; (viii) NN methods for data analysis,
reaction probabilities, and statistical error reduction in chemical
reaction dynamics; (ix) accurate prediction of higher-level
electronic structure energies (e.g. MP4 or higher) for large
databases using NNs, lower-level (Hartree-Fock) energies, and small
subsets of the higher-energy database; and finally (x) illustrative
examples of NN applications to chemical reaction dynamics of
increasing complexity starting from simple near equilibrium
structures (vibrational state studies) to more complex
non-adiabatic reactions.
This book provides a framework for real time control of the Chemical Mechanical Planarization (CMP) process based on combining nonlinear dynamics principles with statistical process monitoring approaches. CMP has a direct bearing on the computational speed and dimensional characteristics of solid state devices. The challenge in CMP may be narrowed to domains enveloping productivity, measured in terms of material removal rate (MRR), and quality which is usually specified in terms of surface roughness - Ra, within wafer non-uniformity (WIWNU), defect rate, etc. In this work, experimental investigations of CMP are executed with the aid of sensors. The analysis of the data reveals the presence of pronounced stochastic-dynamic characteristics. As a result, we derive a process control method integrating statistical time series analysis and nonlinear dynamics which captures 80% (linear R-sq) of the variation in MRR. In this manner a novel paradigm for effective process control in CMP has been presented.
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